3G iPhone has overtaken the M8 for me

Originally Posted by DusL

Well heat makes materials expand and when cooling down it contracts again. If anything it makes a pretty good situation in which a material would "crack". I can't say for sure but it's what my chemestry logic would say. Physics logic makes stress cracks possible too of course, so we'll find out the answer looking at Apple's ability to fix this or not. Might be a combo of the two. We will probably notice any redesign of the nex batch 3g's.

Never heard of the story of the dude whose iPhone3G burned his leg while he was keeping it in his pants? Haha, just kidding, an extreme exception but in general every electrical device "get's hot" because of lack of full electrical efficiëncy. However, "too hot" is a relative term when looking at the "crack-point" of the layer on the case.

Never saw the "will-it-blend"-movie featuring the iPhone3G? They put it in a Blendtec blender after which the entire device was turned into dust except the back plate. That certainly sounds like really, really, really strong cheap plastic. -> It's actually probably a hybrid ceramic/plastic combo or something.

yeah srry hotlinked, (don't know if it's not allowed)

Yeah, all that makes perfect sense to me.
I'll be interested to know the exact and final conclusions as to the cause of this problem.